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導熱墊片典型材料 |
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|
型號 |
結(jié)構(gòu) |
厚度范圍 |
導熱系數(shù) |
密度 |
介電常數(shù)@ 1 MHz |
體積電阻率（ohm-cm） |
|
Tflex 300 |
陶瓷填充硅膠片 |
0.50 -5.08 mm |
1.2 |
1.8 |
4.5(@ 10 GHz) |
1 x 10^13 |
|
Tflex P100 |
Tgard 內(nèi)襯彈性體 |
0.50 - 5.08 mm |
1.2 |
2.3 |
7.5 |
1.3 x 10^12 |
|
Tflex HR400 |
陶瓷填充硅膠彈性體 |
0.50- 10.16 mm |
1.8 |
1.9 |
4.8 |
2 x 10^13 |
|
Tflex HD300 |
陶瓷填充硅膠彈性體 |
0.50 - 5.08 mm |
2.7 |
3.1 |
6.6 |
1.2 x 10^14 |
|
Tflex 600 |
氮化硼填充硅膠彈性體 |
0.50- 5.08 mm |
3 |
1.3 |
3.3 (@10 GHz) |
2 x 10^13 |
|
Tflex HR600 |
陶瓷填充硅膠片 |
0.25 - 5.08 mm |
3 |
2.5 |
19 |
1 x 10^13 |
|
Tflex HD400 |
陶瓷填充硅膠彈性體 |
0.50 -5.08 mm |
4 |
3 |
10.7 |
2.7 x 10^14 |
|
Tflex HD700 |
陶瓷填充硅膠片 |
0.50 -5.08 mm |
5 |
3.3 |
5 |
1.4 x 10^14 |
|
TflexHD80000 |
陶瓷填充硅膠片 |
1.0-5.0mm |
6 |
3.3 |
9 |
1.0 x 10^16 |
|
Tflex SF800 |
陶瓷填充無硅填隙料 |
0.50 - 4.06 mm |
7.8 |
3.2 |
15.9 |
5x 10^12 |
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液態(tài)間隙填材料 |
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|
型號 |
結(jié)構(gòu) |
導熱系數(shù)（W/m-K)(固化后） |
密度 |
阻燃 |
介電擊穿電壓 |
介電常數(shù) @ 1MHz |
|
兩部分陶瓷填充可分配硅膠填隙料 |
3.69 |
3.2 |
V-0 |
9KV AC |
|
|
|
Tflex CR607 |
兩部分陶瓷填充可分配硅膠填隙料 |
6.4 |
3.43 |
V-0 |
6 kV AC |
4.9 |
|
單部分硅基可分配填隙料 |
2.3 |
2.48 |
V-0 |
>6KV AC |
|
|
|
陶瓷填充硅膠可分配填隙料 |
3.7 |
3.2 |
V-0 |
>3KV AC |
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|
陶瓷填充硅膠可分配填隙料 |
6.4 |
3.45 |
V-0 |
>6KV AC (at 40 mil) |
15 |
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相變材料 |
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|
型號 |
厚度范圍 |
導熱系數(shù)（W/m-K) |
密度 |
介電常數(shù)@ 1 MHz |
體積電阻率（ohm-cm） |
相變軟化溫度 (?C) |
|
3.2mm |
1.5 |
|
|
|
|
|
|
0.076- 0.406 mm |
3.8 |
2.87 |
|
3.0 x 10^12 |
50 |
|
|
|
4 |
|
|
|
45-60 |
|
|
0.13- 0.64mm |
7.5 |
2.5 |
31.54 |
5.4x10^15 Ω-cm |
50-70 |
|
|
0.13mm- 0.64mm |
5.4 |
2.5 |
22.9 |
1.5x10^13 Ω-cm |
45-70 |
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|
5.4 |
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|
45 to 70 |
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導熱油脂 |
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型號 |
導熱系數(shù)（W/m-K) |
密度 |
介電常數(shù)@ 1 MHz |
體積電阻率 |
熱阻 (°C in |
粘合層厚度 |
|
Tgrease 1500 |
1.2 |
|
|
|
0.037 |
|
|
Tgrease 2500 |
3.8 |
|
3.5x10^12 |
|
50μm |
|
|
Tgrease 300X |
3 |
2.69 |
|
|
|
25μm |
|
Tgrease 880 |
3.1 |
2.73g/cc |
|
9 x 10^13 |
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絕緣導熱材料 |
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型號 |
厚度 |
伸長率 |
拉伸強度 |
擊穿電壓（AC） |
導熱系數(shù)W/mK |
介電常數(shù) @ 1 MHz |
|
Tgard 200 |
0.25mm |
|
|
6000 |
5 |
3.32 |
|
Tgard 300 |
0.23 mm |
5% |
10 Mpa |
6000 |
|
3.3 |
|
Tgard 500 |
0.23 mm |
5% |
11.7 Mpa |
6000 |
|
3.3 |
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備注：更詳細的產(chǎn)品應用以及產(chǎn)品介紹、相關數(shù)據(jù)請查萊爾德官網(wǎng)，并以官網(wǎng)的資料為準。 |
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Typical Materials for thermally conductive gaskets |
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|
Model |
Structure |
Thickness range |
Thermal conductivity（W/m-K) |
Density |
Dielectric constant @ 1 MHz |
Volumetric resistivity （ohm-cm） |
|
Tflex 300 |
Ceramic Filled Silicone Film |
0.50 -5.08 mm |
1.2 |
1.8 |
4.5(@ 10 GHz) |
1 x 10^13 |
|
Tflex P100 |
Tgard Lined Elastomers |
0.50 - 5.08 mm |
1.2 |
2.3 |
7.5 |
1.3 x 10^12 |
|
Tflex HR400 |
Ceramic-filled silicone elastomer |
0.50- 10.16 mm |
1.8 |
1.9 |
4.8 |
2 x 10^13 |
|
Tflex HD300 |
Ceramic-filled silicone elastomer |
0.50 - 5.08 mm |
2.7 |
3.1 |
6.6 |
1.2 x 10^14 |
|
Tflex 600 |
Boron nitride filled silicone elastomers |
0.50- 5.08 mm |
3 |
1.3 |
3.3 (@10 GHz) |
2 x 10^13 |
|
Tflex HR600 |
Ceramic Filled Silicone Film |
0.25 - 5.08 mm |
3 |
2.5 |
19 |
1 x 10^13 |
|
Tflex HD400 |
Ceramic-filled silicone elastomer |
0.50 -5.08 mm |
4 |
3 |
10.7 |
2.7 x 10^14 |
|
Tflex HD700 |
Ceramic Filled Silicone Film |
0.50 -5.08 mm |
5 |
3.3 |
5 |
1.4 x 10^14 |
|
TflexHD80000 |
Ceramic Filled Silicone Film |
1.0-5.0mm |
6 |
3.3 |
9 |
1.0 x 10^16 |
|
Tflex SF800 |
Ceramic filled silicone-free gap filler |
0.50 - 4.06 mm |
7.8 |
3.2 |
15.9 |
5x 10^12 |
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Liquid gap filling material |
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|
Model |
Structure |
Thermal conductivity（W/m-K) |
Density |
Flame retardant |
Dielectric Breakdown Voltage （2mm) |
Dielectric constant @ 1MHz |
|
Two part ceramic filled dispensable silicone gap filler |
3.69 |
3.2 |
V-0 |
9KV AC |
|
|
|
Tflex CR607 |
Two part ceramic filled dispensable silicone gap filler |
6.4 |
3.43 |
V-0 |
6 kV AC |
4.9 |
|
Single part silica-based dispensable gap fillers |
2.3 |
2.48 |
V-0 |
>6KV AC |
|
|
|
Ceramic filling silica gel dispensable gap filler |
3.7 |
3.2 |
V-0 |
>3KV AC |
|
|
|
Ceramic filling silica gel dispensable gap filler |
6.4 |
3.45 |
V-0 |
>6KV AC (at 40 mil) |
15 |
|
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Phase change materials |
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|
Model |
Thickness range |
Thermal conductivity （W/m-K) |
Density |
Dielectric constant @ 1 MHz |
Volumetric resistivity（ohm-cm） |
Phase change softening temperature (?C) |
|
3.2mm |
1.5 |
|
|
|
|
|
|
0.076- 0.406 mm |
3.8 |
2.87 |
|
3.0 x 10^12 |
50 |
|
|
|
4 |
|
|
|
45-60 |
|
|
0.13- 0.64mm |
7.5 |
2.5 |
31.54 |
5.4x10^15 Ω-cm |
50-70 |
|
|
0.13mm- 0.64mm |
5.4 |
2.5 |
22.9 |
1.5x10^13 Ω-cm |
45-70 |
|
|
|
5.4 |
|
|
|
45 to 70 |
|
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Thermally conductive grease |
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|
Model |
Thermal conductivity（W/m-K) |
Density |
Dielectric constant @ 1 MHz |
Volumetric resistivity |
Thermal resistance (°C in |
Thickness of adhesive layer |
|
Tgrease 1500 |
1.2 |
|
|
|
0.037 |
|
|
Tgrease 2500 |
3.8 |
|
3.5x10^12 |
|
50μm |
|
|
Tgrease 300X |
3 |
2.69 |
|
|
|
25μm |
|
Tgrease 880 |
3.1 |
2.73g/cc |
|
9 x 10^13 |
|
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Insulation and thermal conductivity materials |
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|
Model |
Thickness |
Elongation |
Tensile strength |
Breakdown voltage （AC） |
Thermal conductivity W/mK |
Dielectric constant @ 1 MHz |
|
Tgard 200 |
0.25mm |
|
|
6000 |
5 |
3.32 |
|
Tgard 300 |
0.23 mm |
5% |
10 Mpa |
6000 |
|
3.3 |
|
Tgard 500 |
0.23 mm |
5% |
11.7 Mpa |
6000 |
|
3.3 |
|
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Note: For more detailed product applications and product descriptions and related data, please check Laird's official website and refer to the information on the official website. |
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